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Tokyo Seimitsu Co., Ltd. (7729)

Name: Tokyo Seimitsu Co., Ltd.（7729）— 财务报表历史
Creator: TickerBase
License: https://creativecommons.org/licenses/by/4.0/

来自官方财务报表的收入、利润与现金流历史。

Technology · 华尔街（美国） · 最近更新： 2026-10-02

Tokyo Seimitsu Co., Ltd., together with its subsidiaries, manufactures and sells semiconductor manufacturing equipment and measuring instruments in Japan, China, Taiwan, South Korea, rest of East Asia, Southeast Asia, and internationally. The company offers wafer dicing and probing machines, polish and high rigid grinders, wafer manufacturing machines, chemical mechanical planarizers, edge shaping products, sliced wafer demounting and cleaning machines, precision dicing blades, and equipment for dicing and probing machines.

关键数据

市值: JPY 780 billion
收入（截至 2026-03-31 财年）: JPY 166.8B
净利润: JPY 24.7B
毛利率: 41.3%
净利率: 14.8%

查看交互式图表与完整报表 → 估值模型 (DCF) →

年度利润表

利润表	2026-03-31	2025-03-31	2024-03-31	2023-03-31	2022-03-31
总收入	JPY 166.8B	JPY 150.5B	JPY 134.7B	JPY 146.8B	—
毛利	JPY 68.9B	JPY 62.5B	JPY 54.8B	JPY 61.8B	—
营业利润（EBIT）	JPY 33.7B	JPY 29.7B	JPY 25.3B	JPY 34.5B	—
净利	JPY 24.7B	JPY 25.6B	JPY 19.4B	JPY 23.6B	—

来源：公司公开报告（SEC）。在依赖任何数字前请核对 SEC EDGAR。

资产负债表、现金流、季度数据与完整财务比率见 7729 交互式查看器。 /companies/us/7729

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