来自官方财务报表的收入、利润与现金流历史。
TOWA Corporation engages in the design, development, manufacture, and sale of semiconductor manufacturing equipment and high-precision molds in Japan and internationally. It operates through three segments: Semiconductor Manufacturing Equipment, Medical Device, and Laser Processing Equipment. The Semiconductor Manufacturing Equipment segment manufactures and sells precision molds for semiconductor manufacturing, molding equipment, singulation equipment, etc.; and provides aftersale services. The Medical Device segment manufactures and sells medical devices and other products.
| 利润表 | 2026-03-31 | 2025-03-31 | 2024-03-31 | 2023-03-31 | 2022-03-31 |
|---|---|---|---|---|---|
| 总收入 | JPY 54.4B | JPY 53.5B | JPY 50.5B | JPY 53.8B | — |
| 毛利 | JPY 18.4B | JPY 19.9B | JPY 18.2B | JPY 18.8B | — |
| 营业利润（EBIT） | JPY 6.9B | JPY 8.9B | JPY 8.7B | JPY 10.0B | — |
| 净利 | JPY 4.6B | JPY 8.1B | JPY 6.4B | JPY 7.3B | — |
来源：公司公开报告（SEC）。在依赖任何数字前请核对 SEC EDGAR。
资产负债表、现金流、季度数据与完整财务比率见 6315 交互式查看器。 /companies/us/6315
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